ISTFA 2021 Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis....
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The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
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| Produktnavn | ISTFA 2021 Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis |
| Merke | Other Brand |
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